The ultra-thin heat pipe is formed either by flattening a thin-walled standard heat pipe with a wick structure in between. The wick structure is either a sintered copper powder section on one side of the heat pipe wall, or a copper wire mesh or fiber sintered in the center of the copper sheets. The resulting heat pipe may have low heat transfer capability, but its small size and thin shape allow it to mitigate heat in constricted spaces other solutions may be too bulky to address.

In response to the push to miniaturize increasingly powerful electronics among consumer products, Novark designed the Ultra-Thin Heat Pipe to safely handle the heat dissipation needs of a smartphone- and tablet-driven world. This ultra-thin shape can easily fit inside the cramped internals of a smartphone or notebook, for example, to spread the heat evenly across the device and keep the components from overheating. The Ultra-Thin Heat Pipe also has multiple uses in low-power heat spreading applications beyond the consumer electronics industry.

Due to the highly customizable nature of ultra-thin heat pipe design, please contact Novark for a custom design that fits your thermal management needs. The table below is a representation of Novark’s standard manufacturing capability.

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